About the Summit
What to Expect
Register now for the 9th annual National Cyber Security Summit, held June 6-8, 2017, at the Von Braun Center in Huntsville, Alabama.
The National Cyber Security Summit is the preeminent event for cyber training, education and workforce development aimed at protecting our nation’s infrastructure from the ever-evolving cyber threat. Held in Huntsville, Alabama, one of the nation’s largest technological hubs, the summit attracts commercial companies; healthcare, automotive and energy industries; academia; Department of Defense organizations; and civilian departments and agencies including DHS, NIST, U.S. Army, NASA, TVA, NSF and DOE.
Attracting thousands since its inception in 2008, summit attendees benefit from a diverse offering of educational training sessions, technical and management presentations and keynotes from world-class speakers. The summit offers the unique opportunity to network with your peers, showcase your solutions and learn new skills.
“The cyber threat is one of the most serious economic and national security challenges our nation faces. Cyber security affects nearly every aspect of our lives – critical infrastructure, banking, healthcare, transportation, and more. Our nation’s economic prosperity in the 21st century will depend on how well we manage cybersecurity,” said National Cyber Summit Chair Rodney Robertson.
The event is hosted by the North Alabama Chapter of the Information Systems Security Association (NAC-ISSA), Cyber Huntsville Corporation (CHC), Auburn University Research, and University of Alabama in Huntsville.
“There is no better place to address cyber security than in Huntsville, Alabama,” said Huntsville Mayor Tommy Battle. “This city is at the pinnacle of technology, and the National Cyber Summit brings together the best and brightest from our government, industry, and academic technical community.”
The National Cyber Summit is supported by the National Initiative for Cybersecurity Education (NICE), a program of the National Institute of Standards and Technology in the U.S. Department of Commerce, under Grant # 70NANB16H016.